Semiconductors » Wafer Grinding » China

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Used processing in China

TDL-600/1200
This series of double-sided grinding machine is a high-precision, high-stability grinding and processing equipment, with the upper disc, lower disc, inner ring active drive, can be customized according to custome...
Beijing, China
TSG-200A
The machine is a double spindle, double table, through the diamond grinding wheel, the resin material will be processed by the creep-feed grinding method, with automatic thickness measurement, multi-stage grindin...
Beijing, China
IVG-2040/3040
Fully automatic single-axis thinning machine is suitable for 4-12 inches wafer grinding, equipped with robot up and down, and integrated with automatic centering, cleaning and drying functions, equipped with auto...
Beijing, China
TAP-500/600 Dual series
This series of polishing machine is a high precision single-sided polishing equipment with double polishing discs, which can realize four-axis simultaneous processing, and the equipment can be configured accordin...
Beijing, China
TFG-2200/3200 series
This equipment is a dual spindle three-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with automatic centerin...
Beijing, China
TFG-3250
This equipment is a 3-spindle, 4-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with auto-centering, transfer...
Beijing, China
TSP-610/810/910/1270/1500 series
This series of polishing machine is a ceramic disk as a carrier, through the paste wax or no wax adsorption way to fix the wafer for polishing of high-precision single-sided polishing equipment, dual-axis, four-a...
Beijing, China
IVG-2035/3035
Semi-automatic dual-axis thinning machine is suitable for 2-12 inches wafers and special specifications of the material grinding, manual loading mode, easy to operate, feature-rich, single-axis and dual-axis proc...
Beijing, China
ACCRETECH PG3000/200RM
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: PG3000
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. Features
Suzhou, China
DFG8560
- Manufacturer: SSMC
Conform to the development trend of wafer technology, realize ultra-thin and large caliber wafer processing Gather the essence of existing grinding machine Dfg8540 / 8560 is an upgrade model of dfg800 series with...
Suzhou, China
SGM-450V
SGM-450V Semiconductor industry, electronic connector industry, ceramic industry, tungsten steel industry, precision and high precision parts processing industry, precision mold industry, etc.
Shenzhen, China

Overview

Wafer grinding is a critical process in semiconductor manufacturing, primarily used to thin down silicon wafers to the desired thickness. The process ensures the wafers are uniformly thin and free of surface imperfections, which is crucial for the proper functioning of integrated circuits. This equipment is essential for achieving high precision and quality in wafer production.

FAQ

What factors should I consider when buying a wafer grinding machine?

Consider the machine's precision, grinding speed, and compatibility with different wafer sizes. Check for features like automatic thickness control and surface finish capabilities.

How do I safely ship a wafer grinding machine?

Use a specialized transport service for delicate machinery. Ensure the machine is securely packed with protective materials to prevent any damage during transit.

What maintenance does a wafer grinding machine require?

Regular maintenance includes checking and replacing grinding wheels, cleaning the machine, and ensuring all moving parts are well-lubricated. Follow the manufacturer's guidelines for detailed maintenance schedules.