Semiconductors » Wafer Grinding » Jiangsu

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Used processing in Jiangsu, China

  • ACCRETECH PG3000/200RM

    ACCRETECH PG3000/200RM

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: PG3000

    ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. Features

    Suzhou, China
  • DFG8560

    DFG8560

    • Manufacturer: SSMC

    Conform to the development trend of wafer technology, realize ultra-thin and large-caliber wafer processing Gather the essence of existing grinding machines Dfg8540 / 8560 is an upgrade model of the dfg800 seri...

    Suzhou, China

Overview

Wafer grinding is a critical process in semiconductor manufacturing, primarily used to thin down silicon wafers to the desired thickness. The process ensures the wafers are uniformly thin and free of surface imperfections, which is crucial for the proper functioning of integrated circuits. This equipment is essential for achieving high precision and quality in wafer production.

FAQ

What factors should I consider when buying a wafer grinding machine?

Consider the machine's precision, grinding speed, and compatibility with different wafer sizes. Check for features like automatic thickness control and surface finish capabilities.

How do I safely ship a wafer grinding machine?

Use a specialized transport service for delicate machinery. Ensure the machine is securely packed with protective materials to prevent any damage during transit.

What maintenance does a wafer grinding machine require?

Regular maintenance includes checking and replacing grinding wheels, cleaning the machine, and ensuring all moving parts are well-lubricated. Follow the manufacturer's guidelines for detailed maintenance schedules.