Semiconductors » Wafer Slicing / Dicing » Accretech - Tokyo Seimitsu - TSK » ML200Plus

Search By Model

Search By Country

Building Filters

Related Events

Live Now

Make Offer | Automated Assembly Equipment From Dexcom

by AllSurplus

Online
Ends Jan 31st, 14:00 CST
View event
2

Used Accretech - Tokyo Seimitsu - TSK ML200Plus Wafer Slicing / Dicing

  • ACCRETECH ML200PLUS

    ACCRETECH ML200PLUS

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: ML200Plus

    Suzhou, China
  • ACCRETECH ML200Plus FH

    ACCRETECH ML200Plus FH

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: ML200Plus

    8-inch laser dicing machine with dicing frame handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting ...

    Suzhou, China