- Trusted Seller
Bree, Ireland - Trusted Seller

ESEC 2008SC The Bonder used semiconductor equipment
- Manufacturer: ESEC
- Model: 2008 SC
Bree, Ireland - Trusted Seller

ESEC 2008SC3 Plus
- Manufacturer: ESEC
- Model: 2008 SC
Manufacturer: ESEC Type: Die Bonder Model: ESEC 2008SC3 Plus Description: ESEC 2008SC3 Plus Smart Card Die Bonder
Asia - Trusted Seller

ESEC 2008SC3 Plus
- Manufacturer: ESEC
- Model: 2008 SC
ESEC 2008SC3 Plus Smart Card Die Bonder Ex-Works. Smart card die attach, handle up to 300mm wafer. Configuration of machine base on customer request.
Malacca, Malaysia 
ESEC 2008 SC Die Bonder
- Manufacturer: ESEC
- Model: 2008 SC
Good condition ESEC 2008 SC Die Bonders manufactured in 2008. Located in Malaysia and other countries. Click request price for more information.
Malaysia

