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ASM AD898 Die Bonder
- Manufacturer: ASM
- Model: AD898
“UNIT AS SHOWN IN PICTURES, No additional items included in sale. FOR PARTS OR REPAIR ONLY, NO WARRANTY” ASM AD898 Die Bonder 0-SJ-95268-MY-GX FOR PARTS OR REPAIR. This item is not eligible for a return warranty....
- Trusted Seller
ASM Die Bonding 2574713-21 Rev. B Relay Switching Modul
3 in stock The ASM Die Bonding 2574713-21 Rev. B Relay Switching Module is a component designed for semiconductor manufacturing equipment. Specifically, it is a relay switching module used in the die bonding proc...
$200 USDNew York, USA 
AD898 | ASM Die Bonder - For parts or not working
- Manufacturer: ASM
- Model: AD898
- Trusted Seller
2022 BESI Datacon 2200 evo plus
- Manufacturer: Datacon
- Model: 2200 EVO
- Die Attach, Flip Chip & Multi-Chip Capability - Upgraded Camera & Image Processing - Large Format Heated Stage - Thermal Compensation - Never Used for Production - Open Platform Architecture Condition Like New...
United States - Trusted Seller
Hanmi DTFS Model Cam Press Form 102
- Manufacturer: Hanmi
Hanmi DTFS Model Cam Press Form 102 This Machine is used for Trimming and Forming Micro chip devices from their substrate Leadframe This process is called singulation.
Trim, Ireland - Trusted Seller
DATACON BESI 2200 EVO Like New Year 2012 Europe
- Manufacturer: Datacon
- Model: 2200 EVO
DATACON 2200 EVO Vintage 2012 ( Available November 2019 in Europe ) In R&D Facility Like new – Hardly Used Comes with many extra spares The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultima...
Bree, Ireland - Trusted Seller
2011 Datacon 2200 evo
- Manufacturer: Datacon
- Model: 2200 EVO
https://khs-semi.com/de/datacon-2200-evo Drive System: Dynamic servo drives in X, Y, Z, and P axes Vision System: Datacon image processing system for edge, structure, pattern, and ink-dot recognition Illumina...
Germany - Trusted Seller
Die Bonder Hybrid DATACON - 2200 evo
- Manufacturer: Datacon
- Model: 2200 EVO
Die Bonder Hybrid, DATACON - 2200 evo Vintage 2016, Gen3 1.Location, CMTec AG, Switzerland 2.EVO Generation, Generation 3 3. Software version, on request 4.Operation system, on request 5.Condition, refurbished 6....
Steinhausen, Switzerland - Trusted Seller
Asia - Trusted Seller
2004 ASM AD-8912 Die Bonder
- Manufacturer: ASM
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of di...
Asia 
MDAX-FC810 flip chip die bonder
MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...
Guangzhou, China
Tokyo, Japan- Tokyo, Japan
- Tokyo, Japan
- Tokyo, Japan
