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Used processing in China

  • MDAX-FC810 flip chip die bonder

    MDAX-FC810 flip chip die bonder

      MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...

      Guangzhou, China
    • Submicron Semi-Auto Eutectic Die Bonder

      Submicron Semi-Auto Eutectic Die Bonder with table

        Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

        Guangzhou, China
      • Submicron Semi-Auto Eutectic Die Bonder

        Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B

          Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

          Guangzhou, China
        • Submicron Manual Rotary Die Bonder

          Submicron Manual Rotary Die Bonder RYW-ETB05

            Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

            Guangzhou, China
          • Submicron Manual Rotary Die Bonder

            Submicron Manual Rotary Die Bonder RYW-ETB05S

              Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

              Guangzhou, China
            • MD-DDM08 die demounter

              MD-DDM08 die demounter

              • Manufacturer: Minder Hightech

              Product features： 1. Suitable for wafer peeling process of 8 inches and below; 2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate; 3. Simple and convenient o...

              Guangzhou, China

            Overview

            Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

            FAQ

            What factors should I consider when purchasing a used bonder?

            Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

            How can I ensure safe shipping for a bonder?

            Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

            What is the maintenance routine for a bonder?

            Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.