Semiconductors » Assembly / Packaging (semiconductors)

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Used processing

  • Trusted Seller
    Disco DFD-3D/8 Fully Automatic Dicing

    Disco DFD-3D/8 Fully Automatic Dicing Saw

    • Manufacturer: Disco
    • Model: DFD3D/8

    Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive Method: AC Servo Motor-ball Screw Minimum Stroke: 652mm (25.7") (end to end) Set-up Cut Stroke: 220mm (8.7") Cu...

    Asia
  • 2001 Contact Systems CS-400E

    2001 Contact Systems CS-400E

    • Manufacturer: Contact Systems

    Contact Systems CS-400E Cut & Clinch Through-Hole Insertion Machine Semi-Automatic Insertion Machine Parts: radial, axial, and multi-leaded Arm rest Foot pedal control Easy Control Joystick Printer Connection Man...

    United States
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    2018 OKUHARA MR-250M

    • Manufacturer: OKUHARA

    Manufacturing process: assembly

    Tokyo, Japan
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    OTSUKA HH41-0762-1

    • Manufacturer: OTSUKA

    Manufacturing process: assembly

    Tokyo, Japan
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    2005 KYOWARIKEN &SMZ800

    • Manufacturer: KYOWARIKEN

    Manufacturing process: assembly

    Tokyo, Japan
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    SAMCO PXA-100KM

    • Manufacturer: Samco

    Manufacturing process: assembly

    Tokyo, Japan
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    PANASONIC PC30B-HS

    • Manufacturer: Panasonic
    • Model: PC30B-HS

    Manufacturing process: assembly

    Tokyo, Japan
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    2015 MUSASHI TAD1000

    • Manufacturer: Musashi

    Manufacturing process: assembly

    Tokyo, Japan
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    2005 MUSASHI SM300S-4A(M25-1500)

    • Manufacturer: Musashi

    Manufacturing process: assembly

    Tokyo, Japan
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    2006 RHESCA PTR-5000

    • Manufacturer: RHESCA

    Manufacturing process: assembly

    Tokyo, Japan
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    2012 LINTEC RAD-2010m/12

    • Manufacturer: Lintec
    • Model: RAD-2010M12

    Manufacturing process: assembly | Inch: 6,8,12

    Tokyo, Japan
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    2013 PANASONIC MD-P200US

    • Manufacturer: Panasonic

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    1998 DISCO DFD651

    • Manufacturer: Disco
    • Model: DFD651

    Manufacturing process: assembly | Inch: 4

    Tokyo, Japan
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    2007 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    1997 DISCO DFD640

    • Manufacturer: Disco
    • Model: DFD640

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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Overview

Assembly and packaging equipment for semiconductors covers machines used to turn wafers and dies into finished, tested components. This includes die attach, wire bonders, flip-chip bonders, encapsulation, wafer-level packaging, and final test/inspection tools. These systems demand cleanroom compatibility, precise alignment, controlled environments, and traceable process data to meet yield and reliability targets in microelectronics manufacturing.

FAQ

What should I check when buying used semiconductor assembly/packaging equipment?

Verify maintenance and calibration records, cycle counts, contamination history, software/firmware versions and licenses, compatibility with your wafer/die sizes, and availability of spare parts and qualified service.

How should sensitive packaging tools be shipped?

Use specialized freight with ESD protection, clean covers, desiccants, and shock mitigation. Secure moving parts, drain/process fluids if required, and plan requalification and cleaning after delivery.

What routine maintenance keeps these machines reliable?

Follow OEM preventive schedules: replace filters and vacuum pump oil, check optics and alignments, update firmware, maintain tool calibration, and stock critical spares with a service contract if possible.