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Used processing in USA

  • Trusted Seller
    2020 Disco DAD3231

    2020 Disco DAD3231

    • Manufacturer: Disco
    • Model: DAD3231

    Includes: -2.0 kW Non-Siezing Air Bearing Spindle -Alignment Vision System -Micro Microscope -Auto Alignment -Auto Focus -Auto Kerf Check -6-inch cutting area -GUI Touch Screen Operating System -LED Lighting

    $69,900 USD

    Get financing

    Est. $1,316/mo

    Chicago, IL
  • Trusted Seller
    2018 Disco DAD3240

    2018 Disco DAD3240

    • Manufacturer: Disco
    • Model: DAD3240

    -X-axis: -Y-axis: -Z-axis: -θ-axis: -Spindle: Machine type: Process Equipment | Machine location: Upon Request | Stock #: 442927 | -max. workpiece size: Φ8 inch / Square die 200mm | -cutting range: 210 mm | -cutt...

    $74,900 USD

    Get financing

    Est. $1,410/mo

    Chicago, IL
  • Trusted Seller
    2010 Disco DFL7160

    2010 Disco DFL7160

    • Manufacturer: Disco
    • Model: DFL7160

    Wafer Sizes:12"/300mm Used to cut SIC, currently configured as a 300mm system, should be able to be converted to 200mm with a new chuck. The DFL7160 is a fully automatic laser saw that is compatible with 300 mm...

    United States
  • Trusted Seller
    2011 Disco DAD3350

    2011 Disco DAD3350

    • Manufacturer: Disco
    • Model: DAD3350

    System is complete and there are no known issues with the unit. System comes with BBD/NCS/MAC&MIC scope. OEM Model Description Supports a wide range of applications DAD3350 is capable of handling a maximum of ...

    United States
  • 2001 Contact Systems CS-400E

    2001 Contact Systems CS-400E

    • Manufacturer: Contact Systems

    Contact Systems CS-400E Cut & Clinch Through-Hole Insertion Machine Semi-Automatic Insertion Machine Parts: radial, axial, and multi-leaded Arm rest Foot pedal control Easy Control Joystick Printer Connection Man...

    United States

Overview

Assembly and packaging equipment for semiconductors covers machines used to turn wafers and dies into finished, tested components. This includes die attach, wire bonders, flip-chip bonders, encapsulation, wafer-level packaging, and final test/inspection tools. These systems demand cleanroom compatibility, precise alignment, controlled environments, and traceable process data to meet yield and reliability targets in microelectronics manufacturing.

FAQ

What should I check when buying used semiconductor assembly/packaging equipment?

Verify maintenance and calibration records, cycle counts, contamination history, software/firmware versions and licenses, compatibility with your wafer/die sizes, and availability of spare parts and qualified service.

How should sensitive packaging tools be shipped?

Use specialized freight with ESD protection, clean covers, desiccants, and shock mitigation. Secure moving parts, drain/process fluids if required, and plan requalification and cleaning after delivery.

What routine maintenance keeps these machines reliable?

Follow OEM preventive schedules: replace filters and vacuum pump oil, check optics and alignments, update firmware, maintain tool calibration, and stock critical spares with a service contract if possible.