Semiconductors » Wire Bonders

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Used input output modules

DBC/AMB Substrate-Level Segregation
DBC/AMB Substrate-Level Segregation HandlerIt is an automated DBC/AMB segregation handler which also features advanced AOI system for 3D wire bond inspections and is integrate-able with any 3rd party test systems.
Penang, Malaysia
Smart Cards Making Machine Wire Bonding Machines
- Manufacturer: JINGUAN
Product Description smart Cards Making Machine wire bonding machines Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz current : 25A Pow...
Guangdong, China
ID Cards Smart Cards Wire Bonding Machine
- Manufacturer: JINGUAN
Product Description ID Cards Smart Cards wire bonding machine Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz current : 25A Power cons...
Guangdong, China
Automatic Contactless Cads Chip Filling Antenna Wire Bonding Machine
- Manufacturer: JINGUAN
Product Description Automatic Contactless Cads Chip Filling Antenna Wire Bonding Machine Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz ...
Guangdong, China
Semi Auto Chip Filling Antenna Wire Bonding Machine for Smart Card
- Manufacturer: JINGUAN
Product Description semi Auto Chip Filling Antenna Wire Bonding Machine For Smart Card Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz ...
Guangdong, China
SIM Cards Manufacturing Machine ISO Card Wire Bonding Machines
- Manufacturer: SIM
Product Description SIM Cards Manufacturing Machine ISO Card wire bonding machines Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz cu...
Guangdong, China
Smart Cards Equipment Factory Antenna Wire Bonding Machine
- Manufacturer: JINGUAN
Product Description Smart Cards Equipment Factory Antenna Wire Bonding Machine Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz curren...
Guangdong, China
Automatic Contactless Cards Chip Filling Antenna Wire Bonding Machine
- Manufacturer: JINGUAN
Product Description Automatic Contactless Cards Chip Filling Antenna Wire Bonding Machine Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 H...
Guangdong, China
Contactless Cards Chip Filling Antenna Wire Bonding Machine
- Manufacturer: JINGUAN
Product Description Contactless Cards Chip Filling Antenna Wire Bonding Machine Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz curren...
Guangdong, China
Phone Cards Bank Cards Manufacturing Machine Wire Bonding Machines
- Manufacturer: JINGUAN
Product Description Phone Cards Bank Cards Manufacturing Machine wire bonding machines Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-60 Hz ...
Guangdong, China

Overview

Wire bonders are precision machines used in the semiconductor and electronics industries to connect semiconductor chips to their packages using fine wires. These machines play a crucial role in the manufacturing process of integrated circuits, ensuring reliable electrical connections and high performance of electronic devices.

FAQ

What should I consider when buying a used wire bonder?

Consider the machine's age, operating hours, and maintenance history. It's also important to check the bonding capabilities, such as wire diameter and material compatibility.

How is a wire bonder shipped safely?

Use a specialized shipping company experienced in handling precision equipment. Ensure the wire bonder is securely packaged to prevent any movement or damage during transit.

What is the maintenance schedule for a wire bonder?

Regular maintenance includes cleaning the bonding tool, checking the alignment, and ensuring the wire feed mechanism is functioning properly. Follow the manufacturer's guidelines for detailed maintenance procedures.