Semiconductors » Wafer Grinding

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  • METLAB ABRASIVE GRINDING PLAIN PREMIUM

    METLAB ABRASIVE GRINDING PLAIN PREMIUM DISCS 12'' 300MM

    • Manufacturer: MetLab

    INFORMATION METLAB ABRASIVE GRINDING PLAIN PREMIUM DISCS 12'' 300MM System was de-installed in working operational condition. All returns must comply with stated Return Policy. Please continue: PAYMENT OPTIONS: W...

    $99 USD
    Santa Barbara, CA
  • METLAB ABRASIVE GRINDING PLAIN PREMIUM

    METLAB ABRASIVE GRINDING PLAIN PREMIUM DISCS 12''

    • Manufacturer: MetLab

    INFORMATION METLAB ABRASIVE GRINDING PLAIN PREMIUM DISCS 12'' System was de-installed in working operational condition. All returns must comply with stated Return Policy. Please continue: PAYMENT OPTIONS: We acce...

    $99 USD
    Santa Barbara, CA
  • SFJ K555 NO 56564 GRINDING

    SFJ K555 NO 56564 GRINDING SPINDLES

      INCLUDES: SFJ K555 NO 56564 GRINDING SPINDLES UN-TESTED System was de-installed in working operational condition. All returns must comply with stated Return Policy. Please continue: PAYMENT OPTIONS: We accept Pay...

      $925 USD
      Santa Barbara, CA
    • SFJ AF-50X-160 NO 100992 GRINDING

      SFJ AF-50X-160 NO 100992 GRINDING SPINDLES

      • Manufacturer: SFJ

      INCLUDES: SFJ AF-50X-160 NO 100992 GRINDING SPINDLES UN-TESTED System was de-installed in working operational condition. All returns must comply with stated Return Policy. Please continue: PAYMENT OPTIONS: We acc...

      $850 USD
      Santa Barbara, CA
    • Trusted Seller
      Disco DFG850 Fully Automatic Grinder

      Disco DFG850 Fully Automatic Grinder

      • Manufacturer: Disco
      • Model: DFG850

      Dimensions & weight estimates: Mainframe dim (cm): 120 x 260 x 180 Mainframe weight (kg): 1500 Bypack1 dim (cm): 50 x 110 x 190 Bypack1 weight (kg): 200 E-test area, possible Au-contamination

      Europe
    • Semi Auto-Grinding

      Semi Auto-Grinding

      • Manufacturer: semiconductor equipment manufacturing

      Semiconductor Equipment Manufacturing Co., Ltd. is a well-known company that provides semiconductor equipment products. We provide strict quality control in the company. All our products meet the requirements and...

      Hsinchu County, Taiwan

    Overview

    Wafer grinding is a critical process in semiconductor manufacturing, primarily used to thin down silicon wafers to the desired thickness. The process ensures the wafers are uniformly thin and free of surface imperfections, which is crucial for the proper functioning of integrated circuits. This equipment is essential for achieving high precision and quality in wafer production.

    FAQ

    What factors should I consider when buying a wafer grinding machine?

    Consider the machine's precision, grinding speed, and compatibility with different wafer sizes. Check for features like automatic thickness control and surface finish capabilities.

    How do I safely ship a wafer grinding machine?

    Use a specialized transport service for delicate machinery. Ensure the machine is securely packed with protective materials to prevent any damage during transit.

    What maintenance does a wafer grinding machine require?

    Regular maintenance includes checking and replacing grinding wheels, cleaning the machine, and ensuring all moving parts are well-lubricated. Follow the manufacturer's guidelines for detailed maintenance schedules.