Semiconductors » Wafer Slicing / Dicing

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Used processing machines

Trusted Seller
Arnold Gruppe 72/350 Cropping Saws
- Manufacturer: Arnold Gruppe
Arnold Gruppe 72/360 Cropping Saws Quantity 8 available Running until March 1, 2016 De-installed in July/August 2016 Vintage: 2010-2011 Ø Can process Multi or mono squared ingots from 50mm to 550mm length Ø Autom...
Trim, Ireland
Dicing Machine AD2000T/S
- Manufacturer: SSMC
Achieved smallest footprint possible utilizing our own core technology. Feature1 nWorld's most efficient Dicing Machine Delivering fast X-axis (Up to 1,000mm/sec) and Y-axis (Up to 300mm/sec) processing speed. Lo...
Suzhou, China
DX2231HC Multi-wire Saw
- Manufacturer: Beijing Sinopoly Technology
Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...
Beijing, China
DX485C Multi-wire Saw
- Manufacturer: Beijing Sinopoly Technology
Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...
Beijing, China
ACCRETECH SS10
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: SS10
Fastest and smallest 6-inch dicing machine. Improved operability with the 17-inch touch panel screen. The image-processing engine accommodates variety of work. Feature1 Fastest and smallest 6-inch dicing machine ...
Suzhou, China
ACCRETECH AD3000T/S
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: AD3000T
Tokyo Seimitsu Dicing Machine realizes the remarkable "CoO (Cost of Ownership)" by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date tech...
Suzhou, China
ACCRETECH PS280Plus
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! that previously possible! New connected handlers, short...
Suzhou, China
Semi automatic wafer expander
- Manufacturer: Minder Hightech
Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...
Guangzhou, China

Overview

Wafer dicing is the process of cutting semiconductor wafers into individual chips or die. This is a critical step in semiconductor manufacturing, where precision and cleanliness are paramount. The process typically involves the use of high-precision saws or lasers to ensure each chip is separated without damaging the delicate structures within.

FAQ

What should I consider when buying a wafer dicing machine?

Consider the precision of the machine, the type of cutting technology (saw or laser), the throughput, and compatibility with the wafer sizes you plan to process. Also, check for features that ensure minimal damage and high accuracy.

How do I ensure the wafer dicing machine is shipped safely to my location?

Use a reputable transport service with experience in handling sensitive and high-tech machinery. Ensure the machine is securely packed, ideally in its original packaging, and protected from vibrations and shocks during transit.

What is the maintenance schedule for a wafer dicing machine?

Regular maintenance includes cleaning the cutting area, checking and replacing blades or laser components, and ensuring all moving parts are lubricated. Follow the manufacturer's maintenance guidelines for detailed instructions and intervals.