Semiconductors » Wafer Slicing / Dicing

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Used electronics in para-burajiru

  • Trusted Seller
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    Tokyo Electron Ltd TE-8600 200 mm

    • Manufacturer: Tokyo Electron - TEL

    Tokyo Electron Ltd. TE-8600 200 mm

    Bree, Ireland
  • K&S7100 Semi automatic work piece,

    K&S7100 Semi automatic work piece, dicing system

    • Manufacturer: Kulicke & Soffa

    1- K&S7100 Semi- automatic Work Piece Dicing SystemModel: K&S 7100 AD Dicing SawP/N: 97100-9005-000-00Voltage: 200/240 VACFrequency: 50/60 HzAmperage: 15 APower: 3500 VA - 2” Front-mount Spindle - Air driven DC b...

    Los Angeles, CA
  • Trusted Seller
    Karl Suss MA56 Mask Aligners,

    Karl Suss MA56 Mask Aligners,

    • Manufacturer: SÜSS MicroTec
    • Model: MA 56

    Karl Suss MA 56 Mask Aligners, new electronic control version. Set up for Deep UV and up to 4 inch Dia wafers and 5 Inch Diameter Masks Condition refurbished

    Trim, Ireland
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    TSK A-WD-100A

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-100A

    Manufacturing process: assembly

    Tokyo, Japan
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    ASTRO SE-6003

    • Manufacturer: Astro

    Manufacturing process: ATE | Inch: 8

    Tokyo, Japan
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    2008 TSK A-WD-10B

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-10B

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2018 SHIBASOKU WL15V

    • Manufacturer: SHIBASOKU

    Manufacturing process: ATE

    Tokyo, Japan
  • DX485C Multi-wire Saw

    DX485C Multi-wire Saw

    • Manufacturer: Beijing Sinopoly Technology

    Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

    Beijing, China
  • DX2231HC Multi-wire Saw

    DX2231HC Multi-wire Saw

    • Manufacturer: Beijing Sinopoly Technology

    Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

    Beijing, China

Overview

Wafer dicing is the process of cutting semiconductor wafers into individual chips or die. This is a critical step in semiconductor manufacturing, where precision and cleanliness are paramount. The process typically involves the use of high-precision saws or lasers to ensure each chip is separated without damaging the delicate structures within.

FAQ

What should I consider when buying a wafer dicing machine?

Consider the precision of the machine, the type of cutting technology (saw or laser), the throughput, and compatibility with the wafer sizes you plan to process. Also, check for features that ensure minimal damage and high accuracy.

How do I ensure the wafer dicing machine is shipped safely to my location?

Use a reputable transport service with experience in handling sensitive and high-tech machinery. Ensure the machine is securely packed, ideally in its original packaging, and protected from vibrations and shocks during transit.

What is the maintenance schedule for a wafer dicing machine?

Regular maintenance includes cleaning the cutting area, checking and replacing blades or laser components, and ensuring all moving parts are lubricated. Follow the manufacturer's maintenance guidelines for detailed instructions and intervals.