A semi-automatic UV irradiation system for UV curable dicing tape attached to ring frame for 300mm wafer.
Wafer dicing is the process of cutting semiconductor wafers into individual chips or die. This is a critical step in semiconductor manufacturing, where precision and cleanliness are paramount. The process typically involves the use of high-precision saws or lasers to ensure each chip is separated without damaging the delicate structures within.
Consider the precision of the machine, the type of cutting technology (saw or laser), the throughput, and compatibility with the wafer sizes you plan to process. Also, check for features that ensure minimal damage and high accuracy.
Use a reputable transport service with experience in handling sensitive and high-tech machinery. Ensure the machine is securely packed, ideally in its original packaging, and protected from vibrations and shocks during transit.
Regular maintenance includes cleaning the cutting area, checking and replacing blades or laser components, and ensuring all moving parts are lubricated. Follow the manufacturer's maintenance guidelines for detailed instructions and intervals.