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Used Wafer Slicing / Dicing in South Korea

  • Trusted Seller
    2007 ACCRETECH A-WD-300TX

    2007 ACCRETECH A-WD-300TX

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-300TX

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2004 TSK A-WD-300T

    2004 TSK A-WD-300T

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-300T

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2011 TSK ML300PLUS II

    2011 TSK ML300PLUS II

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: ML300Plus II

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • ITI EXC-1

    ITI EXC-1

    • Manufacturer: ITI

    Application: Dicing | - height: 61" | - width: 53" + 36" radius for Controller | - depth: 44" | - base weight: 5200 lbs. | - overall weight: 6100 lbs. | - dimensions(wxdxh): 53"x44"x61" | - horse power: 6 hp @ 1...

    South Korea
  • Okamoto ADM6D

    Okamoto ADM6D

    • Manufacturer: Okamoto
    • Model: ADM-6D

    Application: Dicing for 6 inch | Axis/block: Item | Work size: ø6" ( ø152.4mm) | X-axis: Useable stroke | Cut speed: 0.1~250 | Y-axis: Useable stroke | Indexing step: 0.001 | Z-axis: Maximum cutting stroke | Min...

    South Korea
  • DYNATEX INTERNATIONALTM DX-III

    DYNATEX INTERNATIONALTM DX-III

    • Manufacturer: Dynatex
    • Model: DX-III

    Application: Scribing | Automatic: Capable of complete, automatic scribing and breaking of many substrate materials | Cost effective: - System integration allows easy hook-up and transport - Superior yield and i...

    South Korea
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    2009 Disco+Towa 6340 and Towa SBS9000

    • Manufacturer: Towa

    Package saw

    Yongin-si, South Korea
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    2010 安永yasunaga TW-320C 2 Sets

    • Manufacturer: 安永yasunaga

    Solar battery wire saw

    Yongin-si, South Korea
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    SEZ Group 304

    • Manufacturer: SEZ Group

    Wafer size: 12"

    Yongin-si, South Korea
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    1995 Sumitomo KC-200A

    • Manufacturer: Sumitomo

    Wafer size: 8

    Yongin-si, South Korea
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    Disco DFD6361 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFD6361

    Good condition Disco DFD6361 Wafer Slicing / Dicings available between 2004 and 2010 years. Located in USA and other countries. Click request price for more information.

    Asia
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    Disco DFD651 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFD651

    Good condition Disco DFD651 Wafer Slicing / Dicings available between 1996 and 2005 years. Located in South Korea and other countries. Click request price for more information.

    South Korea
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    Disco DFL7161 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFL7161

    Good condition Disco DFL7161 Wafer Slicing / Dicings manufactured in 2011. Located in USA and other countries. Click request price for more information.

    Europe
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    Disco DFL7160 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFL7160

    Good condition Disco DFL7160 Wafer Slicing / Dicings available between 1995 and 2012 years. Located in Ireland and other countries. Click request price for more information.

    Ireland
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    Disco DFD6340 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFD6340

    Good condition Disco DFD6340 Wafer Slicing / Dicings available between 2005 and 2011 years. Located in USA and other countries. Click request price for more information.

    Asia
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    Okamoto ADM-6D Wafer Slicing / Dicing

    • Manufacturer: Okamoto
    • Model: ADM-6D

    Good condition Okamoto ADM-6D Wafer Slicing / Dicings. Located in USA and other countries. Click request price for more information.

    Asia

Overview

Wafer dicing is the process of cutting semiconductor wafers into individual chips or die. This is a critical step in semiconductor manufacturing, where precision and cleanliness are paramount. The process typically involves the use of high-precision saws or lasers to ensure each chip is separated without damaging the delicate structures within.

FAQ

What should I consider when buying a wafer dicing machine?

Consider the precision of the machine, the type of cutting technology (saw or laser), the throughput, and compatibility with the wafer sizes you plan to process. Also, check for features that ensure minimal damage and high accuracy.

How do I ensure the wafer dicing machine is shipped safely to my location?

Use a reputable transport service with experience in handling sensitive and high-tech machinery. Ensure the machine is securely packed, ideally in its original packaging, and protected from vibrations and shocks during transit.

What is the maintenance schedule for a wafer dicing machine?

Regular maintenance includes cleaning the cutting area, checking and replacing blades or laser components, and ensuring all moving parts are lubricated. Follow the manufacturer's maintenance guidelines for detailed instructions and intervals.