Used Wafer Slicing / Dicing in Wexford, Ireland

Disco DFD6361 wafer dicing saw 300mm

• Manufacturer: Disco
• Model: DFD6361

Disco DFD6361 Wafer Dicing Saw Configuration: Touch Screen Display with GUI interface Standard 1.2 kW Spindles x2 Automatic Wheel Covers and Sensors Dual Cameras for simultaneous Z1/Z2 kerf check plus Hi-Lo Mag A...

Disco DFD651 Dicing Saw

• Manufacturer: Disco
• Model: DFD651

Disco DFD651 Dicing Saw Vintage 1998 *WAFER DICING SAW *Used Semiconductor Equipment

DISCO DFD 6360 Dicing saws qty 2

• Manufacturer: Disco
• Model: DFD6360

Qty – 2 Disco DFD6360 Dicing Saws

Disco DFD6361 dicing saw

• Manufacturer: Disco
• Model: DFD6361

Disco DFD6361 dicing saw Vintage 2009 Max. 12 inch, has NCS, has BBD Working condition

Disco DFD651 Dicing Saw

• Manufacturer: Disco
• Model: DFD651

DFD651 Dicing Saw Vintage 2004 Available July 2014

DISCO DFD6361 DICING SAW

• Manufacturer: Disco
• Model: DFD6361

Disco DFD6361 *Touch Screen Display GUI interface *Standard 1.2kW spindle(2) *Automatic wheel covers and sensors *Dual cameras for simultaneous Z1/Z2 kerf check plus HiLo Mag *Auto all system condition monitor *A...

Disco DFD 6361 Dicing saw

• Manufacturer: Disco
• Model: DFD6361

Disco DFD 6361 Dicing saw Currently Configured for 300mm wafer size System power rating: 200 – 240 VAC +/- 10%, 3 Phase, 50/60Hz, 18A (Full Load Amps) Loading configuration: load and unload wafer on same cassette...

Disco DFD6340 dicing saw 2 x UNITS AVAILABLE

• Manufacturer: Disco
• Model: DFD6340

Disco DFD6340 dicing saw 2 x UNITS AVAILABLE Vintage 2006 & 2010 Max. 8 inch, has NCS, has BBD Working condition

DISCO DAD 3360 High Torque Dicing Saw

• Manufacturer: Disco
• Model: DAD3360

Specification Model Vintage High Torque Semi-Auto Dicer Chuck table & Cleaning table for 8-inch and 12-inch DAD3360 2016 2.2 kw Spindle Measurement alignment for CSP (Chip Size Package) Auto dress Edge alignment ...

DISCO DFL7161 Laser Wafer Saw used semiconductor equipment

• Manufacturer: Disco
• Model: DFL7161

Disco DFL7161 Laser Saw Vintage 2011 UV Laser 355nm; Wafer size 4 to 8 inch; Handling for Disco 6″ or 8″ frames; Cleaning station, PVA spin coating system; Quartz chuck; 17.99hr laser running Photos attached. Eur...

ZZ-OEM 809-605395

• Manufacturer: Unknown

ZZ-OEM 11611002

• Manufacturer: Unknown

Rokko RS8000G LED Tapeless saw machine with tray output

• Manufacturer: Unknown

Rokko RS8000G+ LED Tapeless saw machine with tray output Vintage 2017 Patented Design Flexible for all package type: BGA / QFN / LGA/ SIP/ Flex BGA/ microSD and other New Twin Track Technology Sawing solution Pro...

Laser Scribe

• Manufacturer: Unknown

The new JPSA ChromaDice™ UV diode-pumped solid-state (DPSS) Laser system delivers high-speed blue LED wafer scribing with typical yields greater than 99% at less than $2 per wafer. This system cuts a well-defined...

Disco DFD651

• Manufacturer: Disco
• Model: DFD651

Disco DFD 651 Spec : (1) for 8” wafer saw (2) Spindle is 2” (3) dual blade