Used Accretech - Tokyo Seimitsu - TSK Semiconductors in Jiangsu, China

1999 TSK 5000A

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: 5000A

TSK UF200

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: UF200

Equipment name: Tester

ACCRETECH A-CS-100A

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-CS-100A

Stand-alone wafer cleaning unit, A-CS-100A will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. Automatic dicing saws. High-pressure water spray up to 10 MPa ...

ACCRETECH SS10

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS10

Fastest and smallest 6-inch dicing machine. Improved operability with the 17-inch touch panel screen. The image-processing engine accommodates variety of work. Feature1 Fastest and smallest 6-inch dicing machine ...

ACCRETECH SS30

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS30

12-inch dicing machine Small footprint with highly stable structure. Compliant with varieties of work Feature1 nFootprint Small footprint with highly stable structure nCompliant with varieties of work ・300mm wafe...

ACCRETECH SS20

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS20

8-inch dicing machine Small footprint with highly stable structure. Compliant with the large work Feature1 nFootprint Small footprint with highly stable structure nCompliant with large wafers 250mm square work si...

ACCRETECH ML200PLUS

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML200Plus

ACCRETECH PS280Plus

• Manufacturer: Accretech - Tokyo Seimitsu - TSK

Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! that previously possible! New connected handlers, short...

ACCRETECH PG3000/200RM

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG3000

ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. Features

2005 ACCRETECH PG200RM

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG200RM

ACCRETECH AD20T/S

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: AD20T

Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw Dicing Saw nFoot print The world's smallest footprint Footprint reduced 40% compared with Accretech's existing machines nHigh Thr...

2004 TSK PG300RM

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG300RM

Equipment name: Grinder thinning machine

ACCRETECH ML200Plus FH

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML200Plus

8-inch laser dicing machine with dicing frame handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting ...

ACCRETECH ML300Plus ⅡWH

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML300Plus-WH

12-inch laser dicing machine with wafer handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing The dicing machine is equ...

ACCRETECH AD3000T/S

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: AD3000T

Tokyo Seimitsu Dicing Machine realizes the remarkable "CoO (Cost of Ownership)" by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date tech...