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2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
- Manufacturer: TDK - Lambda
Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFlipChip software version 3.2 Revision 052 and PC manufacture date 2017
United States 
2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
- Manufacturer: TDK - Lambda
Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFlipChip software version 3.2 Revision 052 and PC Option: Substrate heater 50mm x 50mm or 50mm x 10...
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