Used robots

2013 WALTER HELITRONIC POWER SL PLUS
- Manufacturer: Walter
- Model: Helitronic Power
WALTER - HELITRONIC POWER SL PLUS - 2013 - system HMC - system FANUC with toolstudio - 5 axis + robot - spindle 11,5 kW - toolroom grinder with workpiece loading arm - used good condition - can be tested under po...
Buzica, Slovakia
Trusted Seller
2005 WALTER Helitronic Power Diamond
- Manufacturer: Walter
- Model: Helitronic Power
WALTER Helitronic Power Diamond CNC Sharpening Machine TECHNICAL CHARACTERISTICS: Year: 2005 CN Type: HMC 600 Installed software version: Walter Window Mode Color touch screen: Yes Number of axes: 5 Point ...
Saint-Genix-les-Villages, France
Trusted Seller
DOUBLE DISC VERTICAL GRINDING DAISHO Grind Master GMV-355 G2
- Manufacturer: DAISHO
W1,550 (61") × L1,625 (64") × H2,200 (87") Application A vertical double-disk grinding machine is a grinding machine in which two grinding wheel shafts face each other vertically. There are a variety of machining...
São Paulo, Brazil
Trusted Seller
2007 Dürr CB22896,
- Manufacturer: Dürr
Dürr CB22896 brush deburring system, built in 2007, serial no.: 5364, int. no.: 108, inventory no.: 50-1100102-0, equipped with: 4 ABB RC5 M2004 6-axis robots, serial nos.: 66-64794, 66-64795, 66-58345, 66-58344,...
Laucha an der Unstrut, Germany
2021 Okamoto SPP800ATB Fully Automatic Wafer Polisher (Almost New) Taiwan
- Manufacturer: Okamoto
The 2021 Okamoto SPP800ATB is a fully automated wafer polisher designed for precision polishing in semiconductor manufacturing. Manufactured in Japan, this model features a waxless design, three polishing heads, ...
Taipei City, Taiwan
Trusted Seller
PE ABS PP PVC LLDPE Plastic Crusher/High Speed Grinding Machine Plastic/Rubber Crusher
- Manufacturer: Wensui
1. Low energy consumption, easy to install, operate and maintain 2. By changing the screens of different diameters, you can get different sizes of final waste. 3. When the cutting blade is exposed, the machine st...
Guangdong, China
Used Semiconductor Wafer Double Side Polishing Machine Silicon Wafer Ceramic High Precision Double Endface Grinding Machine 16B Transfer
Factory Transfer Imported C/M/T CGD-16B Double Sided Polishing Machine / Lapping Machine (Transparent Ceramics, Silicon Wafers, Metal Wafers, Sapphire Ying, Wafer, etc.) Sales and Technical Manager Yang: 18103045...
Dongguan, China
Used Automatic Mirror Surface Double Side Grinding Machine/16B Double Side Polishing Machine
Factory Transfer Imported C/M/T CGD-16B Double Sided Polishing Machine/Lapping Machine Sales Technology Manager Yang: 18103045976 Main specifications of the equipment 3-phase 220V, 50Hz Equipment size 1800L x 155...
Dongguan, China
Setting Machine with Fully Automatic Robot Device
- Manufacturer: Nakaya
Setting Machine with Fully Automatic Robot Device Standard Type for Max. 400mm Max. 660mm Long Type Major Specifications
Niigata, Japan
Impulse Hardening Machine with Fully Automatic Robot Device
- Manufacturer: Nakaya
Impulse Hardening Machine with Fully Automatic Robot Device Standard Type for Max. 400mm Max. 660mm Long Type Harden a tip of saw teeth automatically. Automatic feeding by robot device, available 24 hours operati...
Niigata, Japan
Stress Relieving Machine with Fully Automatic Robot Device
- Manufacturer: Nakaya
Stress Relieving Machine with Fully Automatic Robot Device Standard Type for Max. 400mm Max. 660mm Long Type By pressing a saw blade with the special mesh roller, the stress inside of the saw blade can be relieve...
Niigata, Japan
NAKAYA Grinding Machine with Fully Automatic Robot Device
- Manufacturer: Nakaya
NAKAYA Grinding Machine with Fully Automatic Robot Device Type (N3-2C-400L) Max. 660mm Long Type (N3-2C-660L) a. For only 2-edge grinding. (A & B faces) 3rd edge grinding (C face) cannot be done. b. With fully au...
Niigata, Japan
Burr Removing & Washing Machine with Fully Automatic Robot Device
- Manufacturer: Nakaya
Burr Removing & Washing Machine with Fully Automatic Robot Device Standard Type for Max. 400mm Max. 660mm Long Type Burr Removing & Washing Machine Pump Unit Major Specifications
Niigata, Japan
NAKAYA Grinding Machine for Uwame (3rd edge) with Fully Automatic Robot Device
- Manufacturer: Nakaya
NAKAYA Grinding Machine for Uwame (3rd edge) with Fully Automatic Robot Device Standard Type (N3-2U-400L) Max. 660mm Long Type (N3-2U-660L) a. For only 3rd-edge grinding. (C face =Uwame) b. With fully automatic ...
Niigata, Japan
NAKAYA Grinding Machine for R650 Curved Blade with Fully Automatic Robot Device
- Manufacturer: Nakaya
NAKAYA Grinding Machine for R650 Curved Blade with Fully Automatic Robot Device Max. 450mm Curved Saw Blade Model (N3-2CC) a. For only 2-edge grinding of R650 curved blade. (A & B faces) 3rd edge grinding (C face...
Niigata, Japan