IVG-2040/3040
Fully automatic single-axis thinning machine is suitable for 4-12 inches wafer grinding, equipped with robot up and down, and integrated with automatic centering, cleaning and drying functions, equipped with auto...
Beijing, China
IVG-2020/3020
Semi-automatic single-axis thinning machine is suitable for 2-12 inches wafers and special specification material grinding, manual loading mode, simple operation, rich features, configuration of automatic thickne...
Beijing, China
IVG-2035/3035
Semi-automatic dual-axis thinning machine is suitable for 2-12 inches wafers and special specifications of the material grinding, manual loading mode, easy to operate, feature-rich, single-axis and dual-axis proc...
Beijing, China
TFG-2200/3200 series
This equipment is a dual spindle three-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with automatic centerin...
Beijing, China
TFG-3250
This equipment is a 3-spindle, 4-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with auto-centering, transfer...
Beijing, China
TAP-500/600 Dual series
This series of polishing machine is a high precision single-sided polishing equipment with double polishing discs, which can realize four-axis simultaneous processing, and the equipment can be configured accordin...
Beijing, China
TSG-200A
The machine is a double spindle, double table, through the diamond grinding wheel, the resin material will be processed by the creep-feed grinding method, with automatic thickness measurement, multi-stage grindin...
Beijing, China
TAP-400/450/500/600 series
This series of polishing machine is a double-axis high-precision single-sided polishing equipment, equipment can be configured according to different wafers with the corresponding polishing head, vacuum adsorptio...
Beijing, China
TDL-600/1200
This series of double-sided grinding machine is a high-precision, high-stability grinding and processing equipment, with the upper disc, lower disc, inner ring active drive, can be customized according to custome...
Beijing, China
TSP-610/810/910/1270/1500 series
This series of polishing machine is a ceramic disk as a carrier, through the paste wax or no wax adsorption way to fix the wafer for polishing of high-precision single-sided polishing equipment, dual-axis, four-a...
Beijing, China
TDP-1200/1204/1500 series
This series of double-sided polishing machine adopts the upper polishing disc can be swung out of the design, airbag pressure way, with different polishing pads, polishing liquid can realize the double-sided poli...
Beijing, China
TMP-200S
This series of equipment is suitable for CMP polishing equipment for thin films (dielectric layers), including oxide, metal, STI, SOI, MEMS and other products of planarization polishing. It adopts multi-partition...
Beijing, China
TSP-380
The equipment is desktop high-precision single-side polishing equipment, the equipment occupies a small area, easy to operate, can be matched with copper disk, tin disk, glass disk, stainless steel disk, etc., wi...
Beijing, China
Mechanical spindle wafer grinder
Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...
Guangzhou, China
Air spindle semi automatic wafer grinder
□ Semi automatic single axis wafer back thinning □ Grindable wafer size 4-8 " □ Single axis single disc mode □ Online thickness measurement □ Corresponding to irregular specifications MDXZ-G300HG □ Semi automatic...
Guangzhou, China
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