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Used Wafer Slicing / Dicing in Germany

  • Trusted Seller
    2017 Lintec Corporation RAD-2010M/12

    2017 Lintec Corporation RAD-2010M/12

    • Manufacturer: Lintec
    • Model: RAD-2010M12

    A semi-automatic UV irradiation system for UV curable dicing tape attached to ring frame for 300mm wafer.

    Erfurt, Germany
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    Accretech - Tokyo Seimitsu - TSK SEP300 Wafer Slicing / Dicing

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: SEP300

    Good condition Accretech - Tokyo Seimitsu - TSK SEP300 Wafer Slicing / Dicings manufactured in 2012. Located in Germany and other countries. Click request price for more information.

    Germany
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    Accretech - Tokyo Seimitsu - TSK SEP200B Wafer Slicing / Dicing

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: SEP200B

    Good condition Accretech - Tokyo Seimitsu - TSK SEP200B Wafer Slicing / Dicings manufactured in 2007. Located in Germany and other countries. Click request price for more information.

    Germany