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Used computing in Okayama, Japan

  • 2013 SIGIYA SEIKI GRN-20 25W

    2013 SIGIYA SEIKI GRN-20 25W

    • Manufacturer: シギヤ精機

    FANUC0i-TD Swing φ200*600 between centers Max. machining diameter φ100 XZ:145*650 Grinding wheel diameter φ305xφ127 Grinding wheel width 250-340 2080rpm

    Okayama, Japan