Used software in Guangdong, China

Film to Film Die Sorter MDAX-DS380F

• Manufacturer: Minder Hightech

1， Support 12-8 inch wafer input and 12-8 inch wafter output. (support customize wafer sizes) 2， Support multiple die sizes(0.3-25mm). need conversion kits) 3， With strong mapping function. As well as BIN functio...

Submicron Manual Rotary Die Bonder RYW-ETB05

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Manual Rotary Die Bonder RYW-ETB05S

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Semi-Auto Eutectic Die Bonder with table

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...

Submicron Semi-Auto Eutectic Die Bonder RYW-ETB05B

Suitable for Providing ±0.5μm alignment accuracy, it is suitable for various precision positioning, chip placement, and various high-end packaging process applications, including flip-chip bonding, ultrasonic gol...