- Trusted Seller
Panasonic ELMKEA Processor PCB Card FB30T-M Create Flip Chip Bonder Working
- Manufacturer: Panasonic
“Removed from a Panasonic FB30T-M Create Flip Chip Bonder System.” Panasonic ELMKEA Processor PCB Card FB30T-M Create Flip Chip Bonder Working Model No: PCB7 ELMKEX-2 Removed from a Panasonic FB30T-M Create Flip ...
$603 USDAlbuquerque, NM - Trusted Seller
Panasonic CMM1EB Processor PCB Card PCB3 FB30T-M Flip Chip Bonder Working
- Manufacturer: Panasonic
“Removed from a Panasonic FB30T-M Create Flip Chip Bonder System.” Panasonic CMM1EB Processor PCB Card PCB3 FB30T-M Flip Chip Bonder Working Model No: PCB3 CMM1EX-1 Removed from a Panasonic FB30T-M Create Flip Ch...
$803 USDAlbuquerque, NM - Trusted Seller
Panasonic MTMDEX-O Backplane Board PCB FB30T-M Flip Chip Bonder System Used
- Manufacturer: Panasonic
“Removed from a Panasonic FB30T-M Create Flip Chip Bonder System.” Panasonic MTMDEX-O Backplane Board PCB FB30T-M Flip Chip Bonder System Used Inventory # A-13799 Removed from a Panasonic FB30T-M Create Flip Chip...
$603 USDAlbuquerque, NM - Trusted Seller
PANASONIC FCB3 FLIP CHIP BONDER
- Manufacturer: Panasonic
- Model: FCB3
PANASONIC FCB3 FLIP CHIP BONDER 2006 Good Working Condition in warehouse
Bree, Ireland - Trusted Seller
2011 Panasonic FCB3 Flip Chip Bonder NM-SB50A
- Manufacturer: Panasonic
Europe - Trusted Seller
Panasonic KAAA261Flip Chip Bonder
- Manufacturer: Panasonic
- Model: KAAA261
Panasonic KAAA261 Flip Chip Bonder
Bree, Ireland - Trusted Seller
Panasonic KAAA261Flip Chip Bonder used semiconductor equipment
- Manufacturer: Panasonic
Bree, Ireland - Trusted SellerBree, Ireland
- Trusted SellerBree, Ireland
- Trusted SellerBree, Ireland
- Trusted Seller
Seoul, South Korea 2004 Panasonic FCX501-L
- Manufacturer: Panasonic
- Model: FCX501-L
US specification Please inquire for details.
Kawaguchi, Japan2004 Panasonic FCX501-L
- Manufacturer: Panasonic
- Model: FCX501-L
US specification Please inquire for details.
Kawaguchi, Japan
PANASONIC NM-SB50A Flip Chip Bonder
- Manufacturer: Panasonic
Panasonic NM-SB50A Flip Chip Bonder •APPLICABLE SUBSTRATE SIZE : 50 mm square to 330 x 250 mm •APPLICABLE IC SIZE : 1 mm square to 20 mm square •DRY CYCLE TIME : 1.8s/IC •BONDING ACCURACY : 3 μm/3 •IC SUPPLY...
Gyeonggi-do, South Korea- Tokyo, Japan
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