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Used Wafer Slicing / Dicing in Japan

  • Trusted Seller
    DISCO DFD6750

    DISCO DFD6750

    • used

    • Manufacturer: Disco
    • Model: DFD6750

    Toda, Japan
  • Trusted Seller
    DISCO DAD3350

    DISCO DAD3350

    • used

    • Manufacturer: Disco
    • Model: DAD3350

    Manufacturer: DISCO Model: DAD3350 Type of Machine : Wafer saw machine Condition : No malfunctions or missing parts Find more here - https://www.ucymachines.com/ Contact us at - sales@ucymachines.com

    Japan
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    1998 DISCO DFD651

    • used

    • Manufacturer: Disco
    • Model: DFD651

    Manufacturing process: assembly | Inch: 4

    Tokyo, Japan
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    2004 DISCO DAD3350

    • used

    • Manufacturer: Disco
    • Model: DAD3350

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2017 DISCO DFD6340

    • used

    • Manufacturer: Disco
    • Model: DFD6340

    Manufacturing process: assembly | Inch: Square Substrate

    Tokyo, Japan
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    2007 DISCO DFD6361

    • used

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2009 DISCO DFD6340

    • used

    • Manufacturer: Disco
    • Model: DFD6340

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2003 DISCO DFD651

    • used

    • Manufacturer: Disco
    • Model: DFD651

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    2006 DISCO DFD6361

    • used

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
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    LGR-Series

    • new

    • Manufacturer: TOWA JAPAN

    Enables high-precision blade cutting of lead-less device products such as QFN packages. Selectable blade cut(FMS3040-HC) or laser cut(LGR1040) depending on process and lead frame design. Combining dedicated lead ...

    Kyoto, Japan
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