Used Semiconductors in Singapore

Nitto Denko NEL Series DR 8500-II Tape wafer mounter

• Manufacturer: Nitto

Longhill LH830 Wafer Mounter

TSK APM5000 5 Inch Fully Automatic Wafer Prober

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: APM5000

Spin Coater

Subtrate Diameter: 10 to 125 mm Spread Process Time: 0.01 to 99.99s (adjustable) Spread Speed Range: 500 to 3000RPM (adjustable) Spin Process Time: 0.01 to 99.99 (adjustable) Spin Speed Range: 1500 to 8000RPM (ad...

NEBULA SERIES: Semi/ Fully Automated Cluster

LIMITS: THERE AREN’T ANY We dream with you to determine the modules that will bring your potential innovations to reality. PVD, CVD, ALD, masking and parking transfer, stages with heating/cooling, sources that as...

Fujitsu Fully Auto Wafer Mounter

• Manufacturer: Fujitsu

Advantest T5371 Memory Tester

• Manufacturer: Advantest
• Model: T5371

Advantest T5335P Tester

• Manufacturer: Advantest
• Model: T5335P

Single Wafer Processing / Wet Station

Wafer Cleaning Customized According to Customer Requirements Spin Coater

Linear Sputter

This series of Linear Sputter PVD systems allows for high throughput production on large substrates, can be seamlessly integrated into larger clusters of production tools, and provides impressive uniformity. Usin...

ACCµRA100: Education and R&D oriented, High Accuracy Flip-Chip Bonder

The ACCµRA™100 is a semi-automatic flip-chip bonder that guarantees ± 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA™100 combines high precision, acc...

NPS300: Nano imPrinting Stepper with Hot Embossing and UV-NIL capabilities

Micro / Nano Replication at its Best Optimized for the production of nanostructures, the Nano imPrinting Stepper NPS300 is the first ever tool able to combine aligned Hot Embossing and UV-NIL on a same platform. ...

NEO HB: New Automatic Flip-Chip Bonder, Hybrid/ Direct

With ± 1 µm (3 sigmas) post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production. Combining high precision, flexibility and very short cycle tim...

FC150: The Most Flexible High Accuracy Die Bonder

ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications

The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCμRA Plus combines high precision, flexibility and short c...

Teradyne J750EX Test & Measurement (semiconductors)

• Manufacturer: Teradyne
• Model: J750EX

Good condition Teradyne J750EX Test & Measurement (semiconductors)s available between 2015 and 2017 years. Located in Singapore and other countries. Click request price for more information.