Wintel EUV
new
- Manufacturer: Wintel
LPR (Low-Pressure Removal) PE ALD Poly Etcher HARC Doped ACL EER EUV Key Technologies ① Chamber contamination free ② High selectivity ③ rework rate: >10 times ④ Design to under layer strip
Gyeonggi-do, South Korea
new
LPR (Low-Pressure Removal) PE ALD Poly Etcher HARC Doped ACL EER EUV Key Technologies ① Chamber contamination free ② High selectivity ③ rework rate: >10 times ④ Design to under layer strip