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Dicing saws are precision machines used in semiconductor assembly to cut wafers into individual die. They combine high-speed spindles, thin diamond blades and accurate stage control to make clean, repeatable cuts while minimizing chipping and stress. Typical buyers look for compatibility with wafer sizes, blade types, automation level, throughput and software integration for yield-critical production lines.
Check spindle runout and vibration, blade condition and arbor play, stage accuracy and encoder history, coolant and vacuum systems, software version and license, maintenance records, and available spare parts. Request a live demo or video cutting representative wafers.
Drain fluids, secure moving axes and remove fragile peripherals. Use vibration-dampening crating, climate control if needed, a carrier experienced with semiconductor tools, and insure against transit damage. Label consumables and include calibration data.
Replace blades and filters on schedule, monitor spindle bearings and balance, clean coolant tanks and sump, check vacuum seals and stage guides, and perform regular laser/vision and stage calibrations. Keep software updated and stock critical wear parts.