Used Wafer Slicing / Dicing in China

DISCO DFG870

• Manufacturer: Disco

2003 NITTO MA-3000Ⅱ

• Manufacturer: Nitto

Equipment name: WAFER MOUTER

AEM-EVERTECH TM-60

• Manufacturer: AEM-EVERTECH

Equipment name: WAFER MOUTER

2009 LINTEC RAD3510

• Manufacturer: Lintec

Equipment name: WAFER MOUTER

NITTO MA1508N

• Manufacturer: Nitto
• Model: MA1508N

Equipment name: WAFER MOUTER

DISCO DFG840HS

• Manufacturer: Disco
• Model: DFG840HS

HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment

• Manufacturer: Hgtech

Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...

Semi automatic wafer expander

• Manufacturer: Minder Hightech

Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...

6inch Dicing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc. | Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.

MDHYDS12FA 12 inch discing saw for semiconductor industry

• Manufacturer: Disco

Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board

ACCRETECH SS30

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS30

12-inch dicing machine Small footprint with highly stable structure. Compliant with varieties of work Feature1 nFootprint Small footprint with highly stable structure nCompliant with varieties of work ・300mm wafe...