- Trusted Seller
2013 DISCO DFL7360
used
- Manufacturer: Disco
- Model: DFL7360
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2010 DISCO DFD6361
used
- Manufacturer: Disco
- Model: DFD6361
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2007 ACCRETECH A-WD-300TX
used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-300TX
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2004 TSK A-WD-300T
used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-300T
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted SellerSeoul, South Korea
- Trusted Seller
2013 DISCO+SEMES EAD6750
used
- Manufacturer: Disco
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2011 TSK ML300PLUS II
used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2017 DISCO DFL7161
used
- Manufacturer: Disco
- Model: DFL7161
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2012 DISCO DFL7160
used
- Manufacturer: Disco
- Model: DFL7160
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2005 DISCO+HANMI DFD6340+HANMI 3500D
used
- Manufacturer: Disco
- Model: DFD6340
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted SellerSeoul, South Korea
- Yongin-si, South Korea
Disco Hi-Tec America, Inc. DFD6361HC/FC/ET
used
- Manufacturer: Disco
- Model: DFD6361
Fully automatd 300mm DICING w/HC/FC/ET
Yongin-si, South Korea- Yongin-si, South Korea
DISCO HI-TEC AMERICA, INC. DFD6361HC/FC/ET
used
- Manufacturer: Disco
- Model: DFD6361
Fully automatd 300mm DICING w/HC/FC/ET
Yongin-si, South KoreaDisco DFD6361 Wafer Slicing / Dicing
used
- Manufacturer: Disco
- Model: DFD6361
Good condition Disco DFD6361 Wafer Slicing / Dicings available between 2004 and 2010 years. Located in USA and other countries. Click request price for more information.
Asia