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MCXJ-MLS8 Maskless lithography System Equipment specifications
MCXJ-MLS8 Maskless lithography System Sample: Equipment structure diagram Exposure host structure diagram Equipment specifications
Guangzhou, China
MDXN-31D2 Mask aligner
MDXN-31D2 Mask aligner Purpose and characteristics Mainly used for the development and production of small and medium-sized integrated circuits, semiconductor components, optoelectronic devices, surface aco...
Guangzhou, China
MDXN-25X High precision single side lithography machine
MDXN-25X High precision single sided lithography machine Purpose and characteristics This equipment is a precision lithography machine developed by our company specifically for the use characteristics of lithogra...
Guangzhou, China
MDXN-31D4 High precision double-sided lithography machine
MDXN-31D4 High precision double-sided lithography machine Purpose and characteristics This equipment is mainly used for the development and production of small and medium-sized integrated circuits, semiconductor ...
Guangzhou, China
MDLB-ASD2C2D automatic coating and developing machine
MDLB-ASD2C2D automatic coating and developing machine The equipment adopts a stainless steel frame, and the inner and outer sheet metal are stainless steel mirror panels. The bottom of the equipment is equipped w...
Guangzhou, China
MDXN-25D4 High precision mask aligner
MDXN-25D4 High precision mask aligner Purpose and characteristics This equipment is mainly used for the development and production of small and medium-sized integrated circuits, semiconductor components, and surf...
Guangzhou, China
