ESEC 8003 Wafer Slicing / Dicing
Used
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Specifications
- Condition
- used
- Mode 1
- Up And Down Cutting Without Lifting The Blade During The Index Step.
- Mode 2
- Down Cuts Only Are Made With The Blade Lifted During The Index Step. (Dice Or Scribe Mode.)
- Mode 3
- Down Cutting With Up To Three Progressive Levels In The Same Track. The Level And Feed Rate Are Individually Programmable.
- Mode 4
- Up And Down Cutting At Different Levels In The Same Track. Level And Feed Rate
- Mode 5
- Up And Down Cutting With Lifting The Blade During The Index Step. (Dice Mode)
- Mode 6
- 0.0
- Category
- Wafer Slicing / Dicing
- Listing ID
- 193105
Description
Good condition ESEC 8003 Wafer Slicing / Dicings. Located in USA and other countries. Click request price for more information.