VISCOM iS6059 3D SPI Machine in Shenzhen, Guangdong, China
New
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Specifications
- Condition
- new
- System shell:
- 997 mm x 1756 mm x 1753 mm
- Camera technology
- XM Solder Paste Inspection
- Z resolution:
- .1 µm
- Z range:
- Max. 5 mm(.2")
- Megapixel camera:
- 4
- Resolution:
- 12 µm
- Field of view:
- 58 mm x 58 mm（2.2" x 2.2"）
- Detection speed
- Up to 80 cm²/s
- Pcb (printed circuit board) size:
- 508 mm x 508 mm (20" x 20")
- User interface:
- Viscom vVision
- Statistical process control:
- Viscom vSPC / SPC, open interface (optional)
- Verify the repair station:
- Viscom vVerify
- Remote diagnosis:
- Viscom SRC (optional)
- Programming station:
- Viscom PST34 (optional)
- Z resolution
- .1 µm
- Global libraries, global calibration
- transferability to all systems
- Viscom closed loop
- Intelligent communication between Viscom inspection systems and the paste printer and placement machine
- Defects/defect features
- too much/too little solder, missing solder, print displacement (X/Y offset), paste smearing
- Optional
- coplanarity, open area analysis, OCR, DMC
- Subcategory
- Smt spi machine
- Subcategory 2
- Smt inspection equipment
- Listing ID
- 103134199
Description
PCB (Printed Circuit Board) Size:：508 mm x 508 mm (20" x 20")
Field of view:：58 mm x 58 mm
Viscom’s powerful SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately examined. The 3D inline system demonstrates decades of Viscom's experience in reliable, high-throughput solder paste inspection. The latest sensor technology with an orthogonal camera and four lateral views results in the highest inspection quality. Realistic color images ensure quick and clear verification. The FastFlow handling guarantees an extremely high throughput thanks to synchronous in- and outfeed of the assemblies. The system can achieve minimal handling times with minimal mechanical impact loads. Intelligent networking in the SMT line enhances process stability and efficiency.
Latest 3D camera technology
Ultra-fast inspection – also with dual-lane operation