- Trusted Seller
2005 DISCO+HANMI DFD6340+HANMI 3500D
- Manufacturer: Disco
- Model: DFD6340
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2010 DISCO DFD6361
- Manufacturer: Disco
- Model: DFD6361
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2017 DISCO DFL7161
- Manufacturer: Disco
- Model: DFL7161
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2012 DISCO DFL7160
- Manufacturer: Disco
- Model: DFL7160
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea Disco DAD561
- Manufacturer: Disco
- Model: DAD561
Application: Dicing for 6 inch | ������: ������ | Work size: ��152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step range: 0.0001 to 160.0...
South KoreaDisco DAD381
- Manufacturer: Disco
- Model: DAD381
Application: Dicing for 12 inch | Axis/block: Item | Work size: 304.8 x 304.8 | X-axis: Useable stroke | Cut speed: 0.1 ~ 400 | Y-axis: Useable stroke | Indexing step: 0.0001 | Position accuracy (cumulative pitc...
South KoreaDisco DAD 640
- Manufacturer: Disco
- Model: DAD640
Application: Dicing/Cutting/Slotting for 8 inch | Work size: 203.2 | X-axis: Useable stroke | Cut speed: 0.1�� ~ 450 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position accuracy (cumulative pitch): 0.002...
South KoreaDisco DAD-2H/6T
- Manufacturer: Disco
- Model: DAD2H/6T
Application: Dicing/Cutting/Slotting various wafers | ��� workpiece size: ��160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable st...
South KoreaDISCO DFD641
- Manufacturer: Disco
- Model: DFD641
Application: Dicing/Cutting/Slotting various wafers | Models: 6"-compatible automatic dicing saw | Max. work size: �� 203.2 | X-axis: Cutting range (mm) | Max cutting speed (mm/s): 0.1 - 450 | Y-axis: Cutting ...
South KoreaDisco DFD-2S/8
- Manufacturer: Disco
- Model: DFD2S/8
Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Direct Drive | Stroke: 650mm Max | Effective cut stroke: 220mm | Cut speed: 0.7~3000mm/sec | Max programmable stroke: 220mm | Index speed: 3...
South KoreaDisco DAC551
- Manufacturer: Disco
- Model: DAC551
Application: Cutting for 6 inch | ������: ������ | Work size: 220*160 | X-axis: Useable stroke | Cut speed: 0.01~100 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step range: 0.0001 | Position...
South KoreaDisco DAD 320
- Manufacturer: Disco
- Model: DAD320
Application: Dicing/Cutting/Slotting various wafers | ������: ������ | Work size: 160 x 160 | X-axis: Useable stroke | Cut speed: 0.13 ~ 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position accuracy (...
South KoreaDisco DAD 560
- Manufacturer: Disco
- Model: DAD560
Application: Dicing/Cutting/Slotting various wafers | ������: ������ | Work size: ��152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step r...
South KoreaDisco DAD 521
- Manufacturer: Disco
- Model: DAD521
Application: Dicing/Cutting/Slotting various wafers | Work size: ��152.4 | X-axis: Useable stroke | Cut speed: 0.3~300.0 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step: 0.0001 | Position a...
South Korea- South Korea
Disco DFD6361 Assembly / Packaging (semiconductors)
- Manufacturer: Disco
- Model: DFD6361
Good condition Disco DFD6361 Assembly / Packaging (semiconductors)s manufactured in 2010. Located in USA and other countries. Click request price for more information.
Asia