Overview
Defect inspection in semiconductor metrology covers systems and processes used to detect, classify, and quantify defects on wafers, masks, and packaged devices. These tools—optical, e-beam, or surface-scatter based—measure defect size, density and location to improve yield and root-cause analysis. Equipment must meet cleanroom, vibration and ESD requirements and often integrates advanced imaging, classification software, and data analytics for production monitoring and process control.
FAQ
What should I check when buying a used defect inspection system?
Verify detector and optics condition, resolution and sensitivity specs, compatible wafer sizes, software/firmware versions, maintenance and calibration history, availability of spare parts and service contracts, and any upgrades needed for your process node.
How should a defect inspection tool be shipped to protect it?
Use climate-controlled, vibration-damped transport with custom crating, secure ESD protection, and shock monitors. Coordinate disassembly and reassembly with the vendor or certified service team and insure the shipment for high-value equipment.
What maintenance and calibration routines are required?
Perform daily optics and cleanliness checks, monitor vacuum/pumps if applicable, and run regular software backups. Schedule annual OEM or qualified-lab calibration, replace consumables per manufacturer intervals, and keep service records to ensure traceable performance.
