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Used Wafer Slicing / Dicing in South Korea

Trusted Seller
2013 DISCO DFL7360
- Manufacturer: Disco
- Model: DFL7360
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2010 DISCO DFD6361
- Manufacturer: Disco
- Model: DFD6361
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2008 DISCO DFD6360
- Manufacturer: Disco
- Model: DFD6360
De-installed, Warehoused, Can be inspected
Seoul, South Korea
Trusted Seller
2007 ACCRETECH A-WD-300TX
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-300TX
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2004 TSK A-WD-300T
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-300T
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2011 TSK ML300PLUS II
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2013 DISCO+SEMES EAD6750
- Manufacturer: Disco
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2010 DISCO DFL7340
- Manufacturer: Disco
- Model: DFL7340
De-installed, Warehoused, Can be inspected
Seoul, South Korea
Trusted Seller
2017 DISCO DFL7161
- Manufacturer: Disco
- Model: DFL7161
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2012 DISCO DFL7160
- Manufacturer: Disco
- Model: DFL7160
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Trusted Seller
2005 DISCO+HANMI DFD6340+HANMI 3500D
- Manufacturer: Disco
- Model: DFD6340
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea
Disco DAD 521
- Manufacturer: Disco
- Model: DAD 521
Application: Dicing/Cutting/Slotting various wafers | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.3~300.0 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step: 0.0001 | Position ac...
South Korea
Disco DAD 320
- Manufacturer: Disco
- Model: DAD 320
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 160 x 160 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...
South Korea
Disco DAD 560
- Manufacturer: Disco
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing s...
South Korea
Disco DAD-2H/6T
- Manufacturer: Disco
Application: Dicing/Cutting/Slotting various wafers | ◆ workpiece size: ø160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable strok...
South Korea
Disco DFD6361 Wafer Slicing / Dicing
- Manufacturer: Disco
- Model: DFD6361
Good condition Disco DFD6361 Wafer Slicing / Dicings available between 2004 and 2010 years. Located in USA and other countries. Click request price for more information.
Asia