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HGTECH Defect Detection Series Semiconductor Substrate Defect Detection Equipment
- Manufacturer: Hgtech
Product advantages: Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers Detect particles, pits, bumps, scratches, stains, cracks and other defects System resolution: 1-10 μ m No patter...
Wuhan, China
HGTECH Wafer Defect Detection Series Semiconductor Wafer Defect Detection Equipment
- Manufacturer: Hgtech
Product advantages: This equipment can be used for 4-8 inch patterned wafers Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss System resolution: 0.2-0....
Wuhan, China
HGTECH Full-automatic IC Packaging and Laser Marking Series Full-automatic IC Packaging and Laser Marking
- Manufacturer: Hgtech
Suitable for the packaged IC surface marking , automatic loading and unloading, automatic width adjustment, and the effect of the mark detection through OCR and the MES data analysis system and data feedback can ...
Wuhan, China
HGTECH FPC Pico UV Laser Cutting Series FPC Pico UV Laser Cutting Machine
- Manufacturer: Hgtech
Mainly used for FPC covering film cutting, FPC shape cutting, FPC window half cutting and RFPC cover opening etc. It has high accuracy, high stability and consistent cutting HAZ effect. Applicable to FPC board fa...
Wuhan, China
HGTECH Wafer Thickness Measuring Series Semiconductor Wafer Thickness Measuring Equipment
- Manufacturer: Hgtech
Product advantages: Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m ...
Wuhan, China
HGTECH High-Speed FPC Laser Drilling Series High-Speed FPC Laser Drilling Machine
- Manufacturer: Hgtech
Developed for high-speed, high-precision drilling applications for soft and rigid combination boards and other materials, with high precision, high efficiency, micro-hole processing, and convenient shape change, ...
Wuhan, China
HGTECH IC Substrate X-Out Laser Marking Series IC Substrate X-Out Laser Marking Machine
- Manufacturer: Hgtech
Used for automatic identification and laser marking scrap unit on carrier products, which facilitates efficient and accurate identification of subsequent processes and improves the product yield and process effic...
Wuhan, China
HGTECH Wheel Cutting Series Cutter Wheel Cutting Machine
- Manufacturer: Hgtech
Product advantages： The appearance size and the floor area are small, and the cutting stroke is large. High power spindle, high-speed and high-precision motor, closed-loop motion control to ensure production effi...
Wuhan, China
HGTECH Laser Scribing Series Picosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages： Cutting line width is narrow (taking ultraviolet collimation as an example, cutting line width + HAZ ≤ 20 ± 5 μ m) Small edge collapse (≤ 10 μ m） UPH ≥ 10 (UV galvanometer: take 3-inch double ...
Wuhan, China
HGTECH Wafer Cutting Series Wafer Laser Modified Cutting Equipment
- Manufacturer: Hgtech
Product advantages: There is no damage on the surface, no cutting seam, and the edge collapse is very small (≤ 2 μ m) , the edge is small (< 3 μ m） Multi focus modification mode can be adopted to multiply the cut...
Wuhan, China
HGTECH Ceramic Substrate Laser Cutting Series Ceramic Substrate Laser Cutting Machine
- Manufacturer: Hgtech
Suitable for laser cutting of alumina, zirconium oxide, aluminum nitride, silicon nitride and other ceramic materials, equipped with loading and unloading mechanism to achieve high efficiency and high precision a...
Wuhan, China
HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...
Wuhan, China
HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
HGTECH Wafer Marking Series Wafer Laser Marking Equipment
- Manufacturer: Hgtech
Product advantages: Special robot for wafer automatic picking and placing, automatic focusing With different light sources, it can adapt to different accuracy levels Intelligent, visual positioning + automatic ed...
Wuhan, China
HGTECH JR Tray Series New Energy Battery Tray Laser Welding
- Manufacturer: Hgtech
- The equipment based on high-precision large work range 6-axis robot, and high-precision flipping positioning rotary station, working with laser to weld the large-scale battery tray parts;- Working with differen...
Wuhan, China