Semiconductors » Flip Chip Bonders

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Used processing

Overview

Flip chip bonders are semiconductor assembly systems that attach bare dies to substrates using conductive bumps, enabling high-density interconnects without wire bonds. They perform precision die alignment, controlled thermo-compression or ultrasonic bonding, and often integrate underfill dispensing and inspection. Used across IC, sensor, and power device packaging lines, machines differ by throughput, die size range, process type, and software/vision capabilities.

FAQ

What should I check when buying a used flip chip bonder?

Verify alignment accuracy, bonding head condition, heater/chiller function, vacuum and chuck integrity, vision/software versions, run hours, maintenance records, and availability of critical spare parts and consumables.

How should a flip chip bonder be prepared and packaged for shipment?

Drain fluids, secure moving parts, purge or seal sensitive areas to prevent contamination, crate with vibration isolation, include shock/tilt indicators, and use a carrier experienced with semiconductor tools.

What site requirements should I confirm before delivery?

Confirm floor loading, stable power with correct phases and grounding, compressed air/nitrogen, chilled water or dry cooling needs, exhaust or filtration, and adequate cleanroom classification and ESD controls.

What routine maintenance and consumables are typical?

Regular tasks include nozzle and chuck cleaning, vacuum pump service, heater calibration, vision system checks, software backups, and replacing nozzles, O-rings, bump cleaners, and filters as needed.

How do I ensure long-term support and spare parts availability?

Ask the seller about OEM or third-party service contracts, availability of replacement heads and electronics, software licenses, and options for refurbishment, training, or field service agreements.