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Used ESEC 2008SC3 PLUS Die Bonders in Malaysia

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    ESEC 2008SC3 Plus

    ESEC 2008SC3 Plus

    • Manufacturer: ESEC
    • Model: 2008 SC

    ESEC 2008SC3 Plus Smart Card Die Bonder Ex-Works. Smart card die attach, handle up to 300mm wafer. Configuration of machine base on customer request.

    Malacca, Malaysia