Semiconductors » Die Bonders » ESEC » 2008 » Seoul

Search By Model

Building Filters

Related Events

Live Now

Complete Plant Closure - Assets from a Leading Agricultural Blade Plow and Tillage Tool Manufacturer

by Perfection Global, LLC

Online
Ends Jan 20th, 16:00 CST
View event
2

Used ESEC 2008 Die Bonders in Seoul, South Korea

  • Trusted Seller
    2004 ESEC 2008xP

    2004 ESEC 2008xP

    • Manufacturer: ESEC
    • Model: 2008 xP

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2006 ESEC 2008hS3 plus

    2006 ESEC 2008hS3 plus

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea