Used Disco Wafer Grinding in Jiangsu, China

DISCO GNX300

• Manufacturer: Disco

Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts main...

DISCO DFG8540

• Manufacturer: Disco
• Model: DFG8540

Equipment name: Grinder thinning machine

2004 DISCO DFG 850

• Manufacturer: Disco
• Model: DFG850

The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.

2004 DISCO DFG860

• Manufacturer: Disco
• Model: DFG860

Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.

1998 DISCO DFG841

• Manufacturer: Disco
• Model: DFG841