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Used Disco Wafer Slicing / Dicing in China

  • DISCO DFG870

    DISCO DFG870

    • Manufacturer: Disco

    Suzhou, China
  • DISCO DFG840HS

    DISCO DFG840HS

    • Manufacturer: Disco
    • Model: DFG840HS

    Suzhou, China
  • MDHYDS12FA 12 inch discing saw

    MDHYDS12FA 12 inch discing saw for semiconductor industry

    • Manufacturer: Disco

    Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board

    Guangzhou, China