Building Filters
Single Disc Machine TF-1517
- Manufacturer: TVX
Product voltage(v):: 110/220 | Power(w):: 1100 | Speed(rpm):: 174/144 | Chassis diameter(in):: 17〞 | Noise(db):: 53 | Handle:: Adjustable | Net weight(kg):: 45 | Wire lengh(m):: 15 | Machine dimensions(mm):: 111...
Nanjing, China
2006 DISCO DISCO DFD6340+HANMI 3000D
- Manufacturer: Disco
- Model: DFD6340
Suzhou, China
DISCO DFG870
- Manufacturer: Disco
Suzhou, China
Suzhou, China
DISCO GNX300
- Manufacturer: Disco
Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts main...
Suzhou, China
2004 DISCO DFG 850
- Manufacturer: Disco
- Model: DFG850
The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.
Suzhou, China
2005 DISCO DFD6340
- Manufacturer: Disco
- Model: DFD6340
Compared with dfd651 of our company, the production efficiency of dfd6340 can be increased by up to 30% in the step / bevel cutting process and up to 40% in the double cutter cutting process by adopting the oppos...
Suzhou, China
1997 DISCO DAD321
- Manufacturer: Disco
- Model: DAD321
The DAD321 dices a workpiece with diameter up to 6 inch using a high-output air spindle with a The DAD321 dices a workpiece with diameter up to 6 inch using a high-output air spindle with a diamond blade attached...
Suzhou, China
2003 DISCO DAD522
- Manufacturer: Disco
- Model: DAD522
Suzhou, China
2009 DISCO DFD6361
- Manufacturer: Disco
- Model: DFD6361
Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways.
Suzhou, China
1996 DISCO DFD650
- Manufacturer: Disco
- Model: DFD650
Suzhou, China
1996 DISCO DFD651
- Manufacturer: Disco
- Model: DFD651
Suzhou, China
DISCO DFG840HS
- Manufacturer: Disco
- Model: DFG840HS
Suzhou, China
2004 DISCO DFG860
- Manufacturer: Disco
- Model: DFG860
Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.
Suzhou, China
Suzhou, China