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Used electronics in para-burajiru

  • Trusted Seller
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    Disco DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    - Wafer Size: 300 - Group: Electronic - Category: Semiconductor Assembly & Packaging - Family: Dicing Saws/Scribes - Type: Dicing Saw - Manufacturer: Disco

    Asia
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    2007 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan
  • no-image_en.png

    2006 DISCO DFD6361

    • Manufacturer: Disco
    • Model: DFD6361

    Manufacturing process: assembly | Inch: 8

    Tokyo, Japan