Semiconductors » Die Bonders

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Used positioning module

  • MDAX-FC810 flip chip die bonder

    MDAX-FC810 flip chip die bonder

      MDAX-FC810 flip chip die bonder This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips A...

      Guangzhou, China
    • 2018 Finetech FINEPLACER pico ma

      2018 Finetech FINEPLACER pico ma multi purpose die bonder with 5um accuracy

      • Manufacturer: Finetech

      Multi-purpose Die Bonder The FINEPLACER® pico ma is a cost effective bonder designed for prototyping or low-volume production, R&D labs and universities. This versatile platform is used in a wide range of micro a...

      $39,500 USD

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      Est. $743/mo

      San Jose, CA

    Overview

    Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

    FAQ

    What factors should I consider when purchasing a used bonder?

    Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

    How can I ensure safe shipping for a bonder?

    Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

    What is the maintenance routine for a bonder?

    Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.