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  • Trusted Seller
    ESEC 2100XP DIE BONDER used

    ESEC 2100XP DIE BONDER used semiconductor equipment

    • Manufacturer: ESEC
    • Model: 2100 xP

    ESEC 2100XP DIE BONDER – Vintage 2011 We can Install & Maintain all ESEC Bonders as of 2016 Strip handler STH 84 cold; wafer handler 300mm; PDS; vision system; wafer mapping. contact: Used Semiconductor Equipment...

    Bree, Ireland
  • Mühlbauer DS Variation-ECO W2W, die

    Mühlbauer DS Variation-ECO W2W, die bonder, vintage 2023

    • Manufacturer: Mühlbauer

    Operational condition die machine! Spec as following: 1 OS Variation ecoLINE Wafer to Wafer incl. 6" Wafer expander 1x 1.2 Flip Chip unit for chip rotation (up side down) 1x 1.3 Standard Die set up 1x 1.4 Vi...

    Europe
  • Trusted Seller
    2010 ASM AD838

    2010 ASM AD838

    • Manufacturer: ASM
    • Model: AD838

    ASM 838 stamping Type Magazine to Magazine with wafer Mapping With 6 inch and 8 inch wafer expander

    Asia
  • Trusted Seller
    2011 ASM AD838

    2011 ASM AD838

    • Manufacturer: ASM
    • Model: AD838

    ASM 838 stamping Type Magazine to Magazine with wafer Mapping With 6 inch and 8 inch wafer expander

    Asia
  • Trusted Seller
    ESEC 2008HS3 Plus

    ESEC 2008HS3 Plus

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    ESEC 2008HS3 Plus Die Bonder refurbished condition Configuration – 12” wafer table, Writing dispenser, TOS input, Magazine output, wafer map, OBC, PostIQC.

    Asia
  • Trusted Seller
    2015 ASM AD838L Die Bonder

    2015 ASM AD838L Die Bonder

    • Manufacturer: ASM
    • Model: AD838

    Die Bonder was only used for R&D , Excellent condition. Magazine to Magazine Rotary Bond Head Wafer Mapping 6 ~ 8 Inch wafer expander Stamping type dispenser, with rotary motor

    Asia
  • Trusted Seller
    DPE K5-M

    DPE K5-M

    • Manufacturer: DPE

    DPE Die Sorter Ex-Works. Map sorter with foton output.

    Malacca, Malaysia
  • Film to Film Die Sorter

    Film to Film Die Sorter MDAX-DS380F

    • Manufacturer: Minder Hightech

    1， Support 12-8 inch wafer input and 12-8 inch wafter output. (support customize wafer sizes) 2， Support multiple die sizes(0.3-25mm). need conversion kits) 3， With strong mapping function. As well as BIN functio...

    Guangzhou, China

Overview

Bonders are specialized machines used to bond materials together, commonly employed in the semiconductor and electronics industries. They utilize various techniques like thermal, ultrasonic, or adhesive bonding to ensure precise and reliable connections between components, making them essential for manufacturing and assembly processes.

FAQ

What factors should I consider when purchasing a used bonder?

Consider the machine's bonding technology, age, condition, and compatibility with your materials. Verify maintenance records and inspect for any signs of wear or damage.

How can I ensure safe shipping for a bonder?

Choose a reputable shipping company experienced in handling delicate machinery. Ensure the bonder is properly packed and secured to prevent damage during transit.

What is the maintenance routine for a bonder?

Regular maintenance includes cleaning bonding surfaces, checking for wear on critical components, and calibrating the machine. Follow the manufacturer’s maintenance schedule for optimal performance.