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FC300: The High Force and High Accuracy Die Bonder for Large Devices
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...
Singapore
ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications
The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCμRA Plus combines high precision, flexibility and short c...
Singapore
Singapore
ESEC 2008XP3 Die Bonder
- Manufacturer: ESEC
- Model: 2008 xP3
Singapore
Singapore
ESEC 2007 IC-8 Die Bonder
- Manufacturer: ESEC
- Model: 2007
Singapore
ESEC 2008HS Plus Die Bonder
- Manufacturer: ESEC
- Model: 2008 HS Plus
Singapore
ESEC 2008HS3+ Die Bonder
- Manufacturer: ESEC
- Model: 2008
Singapore
ESEC 2006PI Epoxy Lead Frame Die Attach
- Manufacturer: ESEC
- Model: 2006
Singapore
ESEC 2100FC Flip-Chip Die Bonder
- Manufacturer: ESEC
- Model: 2100 FC
Singapore
