Used sic | gan | power modules

Module-Level Burn-in

Input/ output options: JEDEC Tray | Selection of packages: Silicon Carbide (SiC), Gallium Nitride (GaN) Power devices | Channel number: Up to 720 power device burn-in test parallelism | Burn-in duration: Program...

Module-Level Final Test

Input/ output options: Metal Tray, Blister Tray, Plastic Tube Stacker | Selection of packages: Plastic Case Power Modules, Double-side cooling power module (DSC) | Ambient/hot temperature test: Ambient Temperatu...

Final Inspection

Power Module Final Inspection HandlerIt offers advanced final inspection solutions for 2D Pin position, 3D pin height inspection and cosmetic inspection for power modules before packing them into trays or plastic...

Trim & Form

Trim & Form HandlerA fully automated trim, form and singulation system that is designed to meet the challenges of today’s ever more demanding manufacturing processes for molded type power modules.

Ultrasonic Welding Handler

Ultrasonic Welding HandlerThe Cu-plated ceramic printed assembly board in IGBT modules has to be contacted with copper connections so that electricity is conducted as best as possible. The sensitive ceramic must ...

Epoxy Dispense & Case Attach

Epoxy Dispense & Case Attach HandlerA linear concept base handler that offers high precision assembling of plastic case with heatsinks using glue dispensers with short dispensing time and automated screw drivers ...

Lead Frame Attach

Lead Frame Attach Handler Setting the standard for un-singulated lead frames manufacturers by offering high accuracy lead frame attach with easy and reliable lamination. Volume Measuring Type, Auto Positioning in...

Pin Insertion

Pin Insertion HandlerIt is capable of processing any manufacturers reeled thru-hole or press-fit products with real time insertion force monitoring and caters to multiple types of pins depending on requirements.

Die-Level Test

Input options: Waffle Pack, Wafer Ring, De-Taper | Output options: Waffle Tray, Wafer Reconstruction, Tape & Reel | Package type: Die | Test capabilities: AC Test, DC Test, UIS Test at ambient to hot temperature

DBC/AMB Substrate-Level Placement

DBC/AMB Substrate-Level Placement HandlerAn innovative design assembly handler designed to pick & place DBC/AMB substrates on heatsinks with pre-form solder paste which are fed directly into the handler in reel f...

Laser Marking/Welding

Laser Marking/Welding HandlerA stand-alone laser marking handler for DBC/AMB substrate & plastic housings, featuring precise X, Y marking alignment, high accuracy motor positioning and high compatibility with var...

DBC/AMB Substrate-Level Test

Input/ output option: Slot Magazine | Package type: DBC Substrate, AMB Substrate | Ambient/hot temperature test: Ranging from 25°C to 175°C | Temperature control & features: (25°C to 175°C) | Soak time: >90s bas...

DBC/AMB Substrate-Level Segregation

DBC/AMB Substrate-Level Segregation HandlerIt is an automated DBC/AMB segregation handler which also features advanced AOI system for 3D wire bond inspections and is integrate-able with any 3rd party test systems.

RT-ZISO optical isolation detection system

• Manufacturer: 德国罗德与施瓦茨/R&S

Introduction: The RT-ZISO optical isolation detection system sets a new benchmark in isolation probe technology. Including probe holder, R&S probe interface cable, SMA cable, SMA-BNC adapter, transport case; ±30V...

Wafer-Level Inspection

SiC & GaN Wafer-Level AOI HandlerTrooper-V is Pentamaster’s next level high speed AOI handler designed for wafer-level packages. With quality objective lens, it allows for different levels of magnification to acc...