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18

Used table

  • Trusted Seller
    Mycronic My100 SXe-10 Pick and

    Mycronic My100 SXe-10 Pick and Place 2011 #100143

    • Manufacturer: Mycronic

    Mycronic My100 SXe-10 Pick and Place DOM: 9/15/2011 SN: 100143TPSYS: 4.2.5jSW Options: Shared Databases Hydra Hydra high speed Fast place sequence HYDRA large component range T3 Table Midas & Hydra tool kits i...

    Longwood, FL
  • Trusted Seller
    2010 Disco DAD 3350

    2010 Disco DAD 3350

    • Manufacturer: Disco
    • Model: DAD3350

    - 1.8KW Spindle- NCS & BBD- High/low resolution microscope- 8” chuck table, has 6” table but extra cost2010 Vintage

    United States
  • Trusted Seller
    Disco DFL7260 Dicing Saw

    Disco DFL7260 Dicing Saw

    • Manufacturer: Disco
    • Model: DFL7260

    Load/unload port 1 Laser head 2 Cooling chiller Chuck table 1 Spinner table 1 Coater table 1 Vintage 2008 300mm

    Trim, Ireland
  • Trusted Seller
    DISCO DAD 3360 High Torque

    DISCO DAD 3360 High Torque Dicing Saw

    • Manufacturer: Disco
    • Model: DAD3360

    Specification Model Vintage High Torque Semi-Auto Dicer Chuck table & Cleaning table for 8-inch and 12-inch DAD3360 2016 2.2 kw Spindle Measurement alignment for CSP (Chip Size Package) Auto dress Edge alignment ...

    Bree, Ireland
  • Disco DFD-2S/8

    Disco DFD-2S/8

    • Manufacturer: Disco
    • Model: DFD2S/8

    Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Direct Drive | Stroke: 650mm Max | Effective cut stroke: 220mm | Cut speed: 0.7~3000mm/sec | Max programmable stroke: 220mm | Index speed: 3...

    South Korea
  • Trusted Seller
    DISCO DFD640

    DISCO DFD640

    • Manufacturer: Disco
    • Model: DFD640

    Capable of dicing wafers up to 8 inches. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck table for automatic al...

    Toda, Japan
  • Trusted Seller
    DISCO DFD641

    DISCO DFD641

    • Manufacturer: Disco
    • Model: DFD641

    Capable of dicing wafers up to 8 inches. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck table for automatic al...

    Toda, Japan
  • Disco DFD-3D/8

    Disco DFD-3D/8

    • Manufacturer: Disco
    • Model: DFD3D/8

    Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Servo Motor-Direct Drive | Minimum stroke: 652mm (25.7") (end to end) | Set-up cut stroke: 200mm(8.7") | Cut speed: ...

    South Korea
  • Trusted Seller
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    Disco Hi-Tec DFD650

    • Manufacturer: Disco
    • Model: DFD650

    Disco Hi-Tec DFD650 Wafer Dicing Saw EQUIPMENT DETAILS: Tool is running in test clean room. Missing 2 parts below. -Operation manual -Electric drawing 2 Modified parts below. -CSP Cut Soft -Spinner part 1, Casset...

    Bree, Ireland
  • Trusted Seller
    DISCO DFD650

    DISCO DFD650

    • Manufacturer: Disco
    • Model: DFD650

    Equipped with dual spindles for dicing of up to 8-inch wafers. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck ...

    Toda, Japan
  • Trusted Seller
    DISCO DFD651

    DISCO DFD651

    • Manufacturer: Disco
    • Model: DFD651

    Equipped with dual spindles for dicing of up to 8-inch wafers. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck ...

    Toda, Japan
  • Trusted Seller
    DISCO DFD651

    DISCO DFD651

    • Manufacturer: Disco
    • Model: DFD651

    Equipped with dual spindles for dicing of up to 8-inch wafers. This fully automatic dicing machine can automatically remove a frame with a maximum 8-inch wafer mounted from the cassette, transfer it to the chuck ...

    Toda, Japan
  • Trusted Seller
    2000 Disco DAD341

    2000 Disco DAD341

    • Manufacturer: Disco
    • Model: DAD341

    Dicing saw NCS: yes BBD: no Initial pass: yes Transformer: yes Saw table: 8" CE marked: yes

    Asia
  • Trusted Seller
    2000 Disco DAD341

    2000 Disco DAD341

    • Manufacturer: Disco
    • Model: DAD341

    Dicing saw NCS: yes BBD: no Initial pass: yes Transformer: yes Saw table: 8" CE marked: yes

    Asia
  • Trusted Seller
    1999 Disco DAD341

    1999 Disco DAD341

    • Manufacturer: Disco
    • Model: DAD341

    Dicing saw NCS: yes BBD: no Initial pass: yes Transformer: yes Saw table: 8" CE marked: yes

    Asia
12

Overview

Assembly and packaging equipment for semiconductors covers machines used to turn wafers and dies into finished, tested components. This includes die attach, wire bonders, flip-chip bonders, encapsulation, wafer-level packaging, and final test/inspection tools. These systems demand cleanroom compatibility, precise alignment, controlled environments, and traceable process data to meet yield and reliability targets in microelectronics manufacturing.

FAQ

What should I check when buying used semiconductor assembly/packaging equipment?

Verify maintenance and calibration records, cycle counts, contamination history, software/firmware versions and licenses, compatibility with your wafer/die sizes, and availability of spare parts and qualified service.

How should sensitive packaging tools be shipped?

Use specialized freight with ESD protection, clean covers, desiccants, and shock mitigation. Secure moving parts, drain/process fluids if required, and plan requalification and cleaning after delivery.

What routine maintenance keeps these machines reliable?

Follow OEM preventive schedules: replace filters and vacuum pump oil, check optics and alignments, update firmware, maintain tool calibration, and stock critical spares with a service contract if possible.