Semiconductors » Assembly / Packaging (semiconductors)

Search By Manufacturer

Search By Country

Building Filters

8

Used microscope

  • Trusted Seller
    2020 Disco DAD3231

    2020 Disco DAD3231

    • Manufacturer: Disco
    • Model: DAD3231

    Includes: -2.0 kW Non-Siezing Air Bearing Spindle -Alignment Vision System -Micro Microscope -Auto Alignment -Auto Focus -Auto Kerf Check -6-inch cutting area -GUI Touch Screen Operating System -LED Lighting

    $69,900 USD

    Get financing

    Est. $1,316/mo

    Chicago, IL
  • Trusted Seller
    DISCO DAD 2SP6T

    DISCO DAD 2SP6T

    • Manufacturer: Disco
    • Model: DAD2SP/6T

    DICING SAW WITH SPLIT FIELD MICROSCOPE 6″ CAPABILITY

    Billerica, MA
  • Trusted Seller
    DISCO DAD 2H/6T

    DISCO DAD 2H/6T

    • Manufacturer: Disco
    • Model: DAD2H/6T

    DISCO DAD 2H/6T DICING SAW SPLIT FIELD MICROSCOPE 6″ CAPABLITY HIGH POWER SPINDLE MOTORIZED CHUCK ROTATION

    Billerica, MA
  • Trusted Seller
    2010 Disco DAD 3350

    2010 Disco DAD 3350

    • Manufacturer: Disco
    • Model: DAD3350

    - 1.8KW Spindle- NCS & BBD- High/low resolution microscope- 8” chuck table, has 6” table but extra cost2010 Vintage

    United States
  • Disco DFD-2S/8

    Disco DFD-2S/8

    • Manufacturer: Disco
    • Model: DFD2S/8

    Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Direct Drive | Stroke: 650mm Max | Effective cut stroke: 220mm | Cut speed: 0.7~3000mm/sec | Max programmable stroke: 220mm | Index speed: 3...

    South Korea
  • Disco DFD-3D/8

    Disco DFD-3D/8

    • Manufacturer: Disco
    • Model: DFD3D/8

    Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Servo Motor-Direct Drive | Minimum stroke: 652mm (25.7") (end to end) | Set-up cut stroke: 200mm(8.7") | Cut speed: 0.7~3000mm/sec (0.0028 t...

    South Korea
  • Trusted Seller
    Disco DFD-2S/8 Fully Automatic Dicing

    Disco DFD-2S/8 Fully Automatic Dicing Saw

    • Manufacturer: Disco
    • Model: DFD2S/8

    Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive Method: AC Servo Motor Stroke: 650mm Max Effective Cut Stroke: 220mm Cut Speed: 0.7~3000mm/sec ◆ Y - axis Sect...

    Asia
  • Trusted Seller
    Disco DFD-3D/8 Fully Automatic Dicing

    Disco DFD-3D/8 Fully Automatic Dicing Saw

    • Manufacturer: Disco
    • Model: DFD3D/8

    Status: excellent Application: Dicing/Cutting/Slotting various wafers ◆ X - axis Section Drive Method: AC Servo Motor-ball Screw Minimum Stroke: 652mm (25.7") (end to end) Set-up Cut Stroke: 220mm (8.7") Cu...

    Asia

Overview

Assembly and packaging equipment for semiconductors covers machines used to turn wafers and dies into finished, tested components. This includes die attach, wire bonders, flip-chip bonders, encapsulation, wafer-level packaging, and final test/inspection tools. These systems demand cleanroom compatibility, precise alignment, controlled environments, and traceable process data to meet yield and reliability targets in microelectronics manufacturing.

FAQ

What should I check when buying used semiconductor assembly/packaging equipment?

Verify maintenance and calibration records, cycle counts, contamination history, software/firmware versions and licenses, compatibility with your wafer/die sizes, and availability of spare parts and qualified service.

How should sensitive packaging tools be shipped?

Use specialized freight with ESD protection, clean covers, desiccants, and shock mitigation. Secure moving parts, drain/process fluids if required, and plan requalification and cleaning after delivery.

What routine maintenance keeps these machines reliable?

Follow OEM preventive schedules: replace filters and vacuum pump oil, check optics and alignments, update firmware, maintain tool calibration, and stock critical spares with a service contract if possible.