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Assembly and packaging equipment for semiconductors covers machines used to turn wafers and dies into finished, tested components. This includes die attach, wire bonders, flip-chip bonders, encapsulation, wafer-level packaging, and final test/inspection tools. These systems demand cleanroom compatibility, precise alignment, controlled environments, and traceable process data to meet yield and reliability targets in microelectronics manufacturing.
Verify maintenance and calibration records, cycle counts, contamination history, software/firmware versions and licenses, compatibility with your wafer/die sizes, and availability of spare parts and qualified service.
Use specialized freight with ESD protection, clean covers, desiccants, and shock mitigation. Secure moving parts, drain/process fluids if required, and plan requalification and cleaning after delivery.
Follow OEM preventive schedules: replace filters and vacuum pump oil, check optics and alignments, update firmware, maintain tool calibration, and stock critical spares with a service contract if possible.